At present, the development trend of integrated circuits is miniaturization, high power, multi-functionality, and the user's requirements for product reliability are getting higher and higher, which puts forward many new topics for microelectronics manufacturing technology and techniques.
In the manufacturing process of thick film hybrid integrated circuits, one of the main causes of circuit failure is bonding failure. According to statistics, about 70 hybrid integrated circuits More than % of product failures are caused by bonding failures.
This is because the bonding area is inevitably contaminated during the manufacturing process. If not dealt with directly, it will cause defects such as false soldering, desoldering, low bonding strength, etc., so that the long-term reliability of the product is not guaranteed.
Plasma cleaning can effectively remove photoresist, solvent residues, epoxy spills or other organic contaminants from the bonding area. Therefore, plasma cleaning before bonding can greatly reduce the bonding failure rate, thereby improving product reliability.
Plasma cleaning with cleaning, does not damage the chip, does not reduce the film adhesion characteristics, with the traditional liquid phase cleaning unparalleled advantages: from the working principle, the use of electrical energy to produce a low-temperature working environment, does not affect the viscosity of the parts (welding) and the performance of the parts themselves, the plasma cleaning also eliminates the dangers and troubles brought about by chemical reactions.
Equivalent cleaning produces gaseous substances, not liquid waste, which can be discharged directly into the air. As a result, there are no expensive waste disposal systems. Plasma cleaning is controlled by selecting and adjusting process parameters such as power, pressure, time, gas type, etc., which is easy and simple to operate.
In the plasma cleaning process, high-energy electrons collide with gas molecules to dissociate or ionize them, and the various particles produced are used to bombard the cleaned surface or to react chemically with the cleaned surface, effectively removing organic contaminants from the cleaned surface or improving the surface condition.
The use of Ar in the gas plasma cleaning process, argon ions impact on the surface of the huge energy generated by the removal of organic pollutants, bombardment of the mechanical energy generated by the polymer molecules can be separated into small molecules and gasification of the chemical bond.
Using O in the plasma cleaning process, oxygen ions react with organic molecules to form H2O or CO2 gasification. When using a mixture of Ar and O2. cleaning gases, the reaction rate is much faster than using any of the individual gases. Argon ions are accelerated by the negative bias pressure, creating kinetic energy that enhances the reactivity of oxygen. This allows removal of heavily contaminated equipment surfaces.
Plasma cleaning before bonding:
(1) A general increase in bond strength after cleaning;
(2) Reduced polarization after cleaning;
(3) Decreased dispersion of bond strength after cleaning;
(4) Improved failure modes by cleaning.
Plasma cleaning prior to bonding can effectively remove organic contaminants brought about by the various processes themselves in the film bonding region. This results in improved bond strength and reduced desoldering. Plasma cleaning can reduce the bonding failure caused by product failure, to improve the long-term reliability and quality of the product to provide strong process assurance.
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Hefeng Machinery Group focuses on the development and application of surface treatment industry for more than 20 years, corona machine, corona treatment machine, plasma machine, static generator, static eliminator, dust removal machine, UV curing, UV power supply, electronic UV, UV light box, plasma treatment system, vacuum plasma, spark machine, plasma treatment, flame treatment machine, electronic spark machine, EDM impact machine, surface treatment machine, polymer Surface Flowering Machine, UV lamp, UV transformer, and so on. It is a national high-tech enterprise integrating R&D, production and sales.
Our core competitiveness comes from the fact that we never stop launching new products and designing molds, and vigorously investing in the research and development of new products, it is this guiding principle that makes us different, which also enables us to become a real solution-oriented company in the industry. From the design of the solution to the final inspection of the equipment, we pay meticulous attention to every detail to ensure that the quality of our products and customer service meets the highest standards, and with our highly qualified service team and experienced technicians, we have gained an international reputation as a solid and reliable partner.
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